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1

Power bus decoupling on multilayer printed circuit boards

Hubing, T.H., Drewniak, J.L., Van Doren, T.P., Hockanson, D.M.

Journal:

IEEE Transactions on Electromagnetic Compatibility

Année:

1995

Langue:

english

Fichier:

PDF, 966 KB

english, 1995

2

Investigation of fundamental EMI source mechanisms driving common-mode radiation from printed circuit boards with attached cables

Hockanson, D.M., Drewniak, J.L., Hubing, T.H., Van Doren, T.P., Fei Sha, Wilhelm, M.J.

Journal:

IEEE Transactions on Electromagnetic Compatibility

Année:

1996

Langue:

english

Fichier:

PDF, 1.02 MB

english, 1996

3

Power bus decoupling on multilayer printed circuit boards

Hubing, Todd H., Drewniak, James L., Van Doren, Thomas P., Hockanson, David M.

Journal:

Electromagnetic Compatibility Magazine, IEEE

Année:

2020

Fichier:

PDF, 6.52 MB

2020

4

[IEEE International Symposium on Electromagnetic Compatibility - Atlanta, GA, USA (14-18 Aug. 1995)] Proceedings of International Symposium on Electromagnetic Compatibility - FDTD modeling of thin wires for simulating common-mode radiation from structures with attached cables

Hockanson, D.M., Drewniak, J.L., Hubing, T.H., Van Doren, T.P.

Année:

1995

Langue:

english

Fichier:

PDF, 582 KB

english, 1995

5

[IEEE 2001 International Symposium on Electromagnetic Compatibility (EMC 2001) - Montreal, Que., Canada (13-17 Aug. 2001)] 2001 IEEE EMC International Symposium. Symposium Record. International Symposium on Electromagnetic Compatibility (Cat. No.01CH37161) - Grounding of heatpipe/heatspreader and heatsink structures for EMI mitigation

Wang, C., Drewniak, J.L., Knighten, J.L., Wang, D., Alexander, R., Hockanson, D.M.

Année:

2001

Langue:

english

Fichier:

PDF, 625 KB

english, 2001

6

FDTD modeling of common-mode radiation from cables

Hockanson, D.M., Drewniak, J.L., Hubing, T.H., Van Doren, T.P.

Journal:

IEEE Transactions on Electromagnetic Compatibility

Année:

1996

Langue:

english

Fichier:

PDF, 1.34 MB

english, 1996

7

FDTD and experimental investigation of EMI from stacked-card PCB configurations

Hockanson, D.M., Xiaoning Ye, Drewniak, J.L., Hubing, T.H., Van Doren, T.P., Dubroff, R.E.

Journal:

IEEE Transactions on Electromagnetic Compatibility

Année:

2001

Langue:

english

Fichier:

PDF, 391 KB

english, 2001

8

High-performance inter-PCB connectors: analysis of EMI characteristics

Xiaoning Ye, Drewniak, J.L., Nadolny, J., Hockanson, D.M.

Journal:

IEEE Transactions on Electromagnetic Compatibility

Année:

2002

Langue:

english

Fichier:

PDF, 329 KB

english, 2002

9

[IEEE 2002 International Symposium on Electromagnetic Compatibility - Minneapolis, MN, USA (19-23 Aug. 2002)] IEEE International Symposium on Electromagnetic Compatibility - External parasitic inductance in microstrip and stripline geometries of finite size

Koledintseva, M.Y., Drewniak, J.L., Van Doren, T.P., Hockanson, D.M.

Année:

2002

Langue:

english

Fichier:

PDF, 248 KB

english, 2002

10

[IEEE 51st Electronic Components and Technology Conference 2001. Proceedings - Orlando, FL, USA (29 May-1 June 2001)] 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220) - Distributed SPICE circuit model for ceramic capacitors

Smith, L.D., Hockanson, D.

Année:

2001

Langue:

english

Fichier:

PDF, 319 KB

english, 2001

11

[IEEE 2005 International Symposium on Electromagnetic Compatibility, 2005. EMC 2005. - Chicago, Il, USA (8-12 Aug. 2005)] 2005 International Symposium on Electromagnetic Compatibility, 2005. EMC 2005. - Reducing radiated emissions from CPUs through core power interconnect design

Hockanson, D.M., Slone, R.D.

Année:

2005

Langue:

english

Fichier:

PDF, 400 KB

english, 2005

12

[IEEE 2000 International Symposium on Electromagnetic Compatibility (EMC 2000) - Washington, DC, USA (21-25 Aug. 2000)] IEEE International Symposium on Electromagnetic Compatibility. Symposium Record (Cat. No.00CH37016) - The EMI benefits of ground plane stitching in multi-layer power bus stacks

Xiaoning Ye,, Hockanson, D.M., Min Li,, Wei Cui,, Radu, S., Drewniak, J.L., VanDoren, T.P., Hubing, T.H., DuBroff, R.E.

Année:

2000

Langue:

english

Fichier:

PDF, 546 KB

english, 2000

13

[IEEE 2007 IEEE International Symposium on Electromagnetic Compatibility - Honolulu, HI, USA (2007.07.9-2007.07.13)] 2007 IEEE International Symposium on Electromagnetic Compatibility - Power Delivery for High Performance Processor Packages - Part I

Hockanson, David, DiBene II, J. Ted

Année:

2007

Langue:

english

Fichier:

PDF, 341 KB

english, 2007

14

[IEEE 2006 IEEE International Symposium on Electromagnetic Compatibility, 2006. EMC 2006. - Portland, OR, USA (2006.08.14-2006.08.18)] 2006 IEEE International Symposium on Electromagnetic Compatibility, 2006. EMC 2006. - Power integrity considerations for CPU EMI-reducing interconnect design

Hockanson, D.M.

Année:

2006

Langue:

english

Fichier:

PDF, 301 KB

english, 2006

15

[IEEE 2004 International Symposium on Electromagnetic Compatibility - Silicon Valley, CA, USA (9-13 Aug. 2004)] 2004 International Symposium on Electromagnetic Compatibility (IEEE Cat. No.04CH37559) - Investigation of EMI coupling at CPU interconnect

Hockanson, D.M., Slone, R.D.

Année:

2004

Langue:

english

Fichier:

PDF, 557 KB

english, 2004

16

Evaluation of community-based programs to increase booster seat use

Renée M. St. Louis, Julie E. Parow, David W. Eby, C. Raymond Bingham, Heather M. Hockanson, Arlene I. Greenspan

Journal:

Accident Analysis & Prevention

Année:

2008

Langue:

english

Fichier:

PDF, 130 KB

english, 2008

17

Factors influencing the use of booster seats: A state-wide survey of parents

C. Raymond Bingham, David W. Eby, Heather M. Hockanson, Arlene I. Greenspan

Journal:

Accident Analysis & Prevention

Année:

2006

Langue:

english

Fichier:

PDF, 144 KB

english, 2006

18

Numerical and experimental corroboration of an FDTD thin-slot model for slots near corners of shielding enclosures

Min Li, Kuang-Ping Ma, Hockanson, D.M., Drewniak, J.L., Hubing, T.H., Van Doren, T.P.

Journal:

IEEE Transactions on Electromagnetic Compatibility

Année:

1997

Langue:

english

Fichier:

PDF, 157 KB

english, 1997

19

Quantifying EMI resulting from finite-impedance reference planes

Hockanson, D.M., Dreniak, J.L., Hubing, T.H., van Doren, T.P., Fei Sha, Cheung-Wei Lam

Journal:

IEEE Transactions on Electromagnetic Compatibility

Année:

1997

Langue:

english

Fichier:

PDF, 390 KB

english, 1997

20

EMI mitigation with multilayer power-bus stacks and via stitching of reference planes

Xiaoning Ye, Hockanson, D.A., Min Li, Yong Ren, Wei Cui, Drewniak, J.L., DuBroff, R.E.

Journal:

IEEE Transactions on Electromagnetic Compatibility

Année:

2001

Langue:

english

Fichier:

PDF, 296 KB

english, 2001

21

[IEEE 52nd Electronic Components and Technology Conference - San Diego, CA, USA (28-31 May 2002)] 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345) - A transmission-line model for ceramic capacitors for CAD tools based on measured parameters

Smith, L.D., Hockanson, D., Kothari, K.

Année:

2002

Langue:

english

Fichier:

PDF, 586 KB

english, 2002

22

[IEEE IEEE 1997 IEEE 1997 International Symposium on Electromagnetic Compatibility Symposium Record - Austin, TX, USA (18-22 Aug. 1997)] IEEE 1997, EMC, Austin Style. IEEE 1997 International Symposium on Electromagnetic Compatibility. Symposium Record (Cat. No.97CH36113) - Effects of gapped groundplanes and guard traces on radiated EMI

Britt, D.S., Hockanson, D.M., Sha, F., Drewniak, J.L., Hubing, T.H., Van Doren, T.P.

Année:

1997

Langue:

english

Fichier:

PDF, 664 KB

english, 1997

23

[IEEE IEEE 1997 IEEE 1997 International Symposium on Electromagnetic Compatibility Symposium Record - Austin, TX, USA (18-22 Aug. 1997)] IEEE 1997, EMC, Austin Style. IEEE 1997 International Symposium on Electromagnetic Compatibility. Symposium Record (Cat. No.97CH36113) - Investigation of split groundplanes at the connector for EMI control

Hockanson, D., Drewniak, J.L., Nuebel, J., Parker, J.C.

Année:

1997

Langue:

english

Fichier:

PDF, 811 KB

english, 1997

24

[IEEE Symposium on Electromagnetic Compatibility - Santa Clara, CA, USA (19-23 Aug. 1996)] Proceedings of Symposium on Electromagnetic Compatibility - Experimental and numerical investigations of fundamental radiation mechanisms in PCB designs with attached cables

Hockanson, D.M., Lam, C.-W., Drewniak, J.L., Hubing, T.H., Van Doren, T.P.

Année:

1996

Langue:

english

Fichier:

PDF, 646 KB

english, 1996

25

[IEEE 1999 International Symposium on Electromagnetic Compatibility (EMC'99) - Seattle, WA, USA (2-6 Aug. 1999)] 1999 IEEE International Symposium on Electromagnetic Compatability. Symposium Record (Cat. No.99CH36261) - An investigation of PCB radiated emissions from simultaneous switching noise

Radu, S., Hockanson, D.

Année:

1999

Langue:

english

Fichier:

PDF, 598 KB

english, 1999

26

[IEEE International Symposium on Electromagnetic Compatibility (EMC'98) - Denver, CO, USA (24-28 Aug. 1998)] 1998 IEEE EMC Symposium. International Symposium on Electromagnetic Compatibility. Symposium Record (Cat. No.98CH36253) - Considerations for magnetic-field coupling resulting in radiated EMI

Hockanson, D., Drewniak, J.L., DuBroff, R.E., Hubing, T.H., Van Doren, T.P.

Année:

1998

Langue:

english

Fichier:

PDF, 644 KB

english, 1998

27

[IEEE 1999 International Symposium on Electromagnetic Compatibility (EMC'99) - Seattle, WA, USA (2-6 Aug. 1999)] 1999 IEEE International Symposium on Electromagnetic Compatability. Symposium Record (Cat. No.99CH36261) - RF isolation using power islands in DC power bus design

Jun Fan,, Yong Ren,, Juan Chen,, Hockanson, D.M., Hao Shi,, Drewniak, J.L., Hubing, T.H., Van Doren, T.P., DuBroff, R.E.

Année:

1999

Langue:

english

Fichier:

PDF, 551 KB

english, 1999

28

[IEEE IEEE 1997 IEEE 1997 International Symposium on Electromagnetic Compatibility Symposium Record - Austin, TX, USA (18-22 Aug. 1997)] IEEE 1997, EMC, Austin Style. IEEE 1997 International Symposium on Electromagnetic Compatibility. Symposium Record (Cat. No.97CH36113) - Investigation of internal partitioning in metallic enclosures for EMI control

Radu, S., Li, M., Nuebel, J., Hockanson, D.M., Ji, Y., Drewniak, J.L., Hubing, T.H., VanDoren, T.P.

Année:

1997

Langue:

english

Fichier:

PDF, 747 KB

english, 1997

29

[IEEE International Symposium on Electromagnetic Compatibility (EMC'98) - Denver, CO, USA (24-28 Aug. 1998)] 1998 IEEE EMC Symposium. International Symposium on Electromagnetic Compatibility. Symposium Record (Cat. No.98CH36253) - The effect of corrosion on shielding effectiveness of a zinc-coated steel enclosure

Das, S.K., Nuebel, J., Zand, B., Hockanson, D., Xie, J., Pecht, M.

Année:

1998

Langue:

english

Fichier:

PDF, 696 KB

english, 1998

30

Stop that noise

Van Doren, T., Hubing, T., Fei Sha,, Drewniak, J., Hockanson, D.

Journal:

IEEE Potentials

Année:

1995

Langue:

english

Fichier:

PDF, 547 KB

english, 1995

31

[IEEE IEEE Symposium on Electromagnetic Compatibility - Chicago, IL, USA (22-26 Aug. 1994)] Proceedings of IEEE Symposium on Electromagnetic Compatibility - Application of the finite-difference time-domain method to radiation from shielded enclosures

Hockanson, D.M., Drewniak, J.L., Hubing, T.H., Van Doren, T.P.

Année:

1994

Langue:

english

Fichier:

PDF, 433 KB

english, 1994

32

METHOD OF EDGE CURRENTS FOR CALCULATING MUTUAL EXTERNAL INDUCTANCE IN A MICROSTRIP STRUCTURE

Koledintseva, Marina Y., Drewniak, James L., Van Doren, Thomas P., Pommerenke, David J., Cocchini, Matteo, Hockanson, David M.

Journal:

Progress In Electromagnetics Research

Année:

2008

Langue:

english

Fichier:

PDF, 539 KB

english, 2008

33

MUTUAL EXTERNAL INDUCTANCE IN STRIPLINE STRUCTURES

Koledintseva, Marina Y., Drewniak, James L., Van Doren, Thomas P., Pommerenke, David J., Cocchini, Matteo, Hockanson, David M.

Journal:

Progress In Electromagnetics Research

Année:

2008

Langue:

english

Fichier:

PDF, 387 KB

english, 2008

34

Power Integrity for Electrical and Computer Engineers || Platform Technologies and System Considerations

Ted Dibene, J., Hockanson, David

Année:

2019

Langue:

english

Fichier:

PDF, 11.39 MB

english, 2019

35

Power Integrity for Electrical and Computer Engineers || Power Conversion for Power Integrity

Ted Dibene, J., Hockanson, David

Année:

2019

Langue:

english

Fichier:

PDF, 2.35 MB

english, 2019

36

Power Integrity for Electrical and Computer Engineers || Introduction

Ted Dibene, J., Hockanson, David

Année:

2019

Langue:

english

Fichier:

PDF, 3.35 MB

english, 2019

37

Power Integrity for Electrical and Computer Engineers || Frequency‐Domain Analysis

Ted Dibene, J., Hockanson, David

Année:

2019

Langue:

english

Fichier:

PDF, 16.97 MB

english, 2019

38

Power Integrity for Electrical and Computer Engineers || Transmission Line Theory and Application

Ted Dibene, J., Hockanson, David

Année:

2019

Langue:

english

Fichier:

PDF, 2.73 MB

english, 2019

39

Power Integrity for Electrical and Computer Engineers || Electromagnetic Concepts for Power Integrity

Ted Dibene, J., Hockanson, David

Année:

2019

Langue:

english

Fichier:

PDF, 1.46 MB

english, 2019

40

Power Integrity for Electrical and Computer Engineers || Appendices

Ted Dibene, J., Hockanson, David

Année:

2019

Langue:

english

Fichier:

PDF, 555 KB

english, 2019

41

Power Integrity for Electrical and Computer Engineers || Index

Ted Dibene, J., Hockanson, David

Année:

2019

Langue:

english

Fichier:

PDF, 55 KB

english, 2019

42

Power Integrity for Electrical and Computer Engineers || Front Matter

Ted Dibene, J., Hockanson, David

Année:

2019

Langue:

english

Fichier:

PDF, 80 KB

english, 2019

43

Power Integrity for Electrical and Computer Engineers || Platform Technologies and System Considerations

Ted Dibene, J., Hockanson, David

Année:

2019

Fichier:

PDF, 11.39 MB

2019

44

Power Integrity for Electrical and Computer Engineers || Power Conversion for Power Integrity

Ted Dibene, J., Hockanson, David

Année:

2019

Fichier:

PDF, 2.35 MB

2019

45

Power Integrity for Electrical and Computer Engineers || Introduction

Ted Dibene, J., Hockanson, David

Année:

2019

Fichier:

PDF, 3.35 MB

2019

46

Power Integrity for Electrical and Computer Engineers || Front Matter

Ted Dibene, J., Hockanson, David

Année:

2019

Fichier:

PDF, 80 KB

2019

47

Power Integrity for Electrical and Computer Engineers || Appendices

Ted Dibene, J., Hockanson, David

Année:

2019

Fichier:

PDF, 555 KB

2019

48

Power Integrity for Electrical and Computer Engineers || Index

Ted Dibene, J., Hockanson, David

Année:

2019

Fichier:

PDF, 55 KB

2019

49

Power Integrity for Electrical and Computer Engineers ||

Ted Dibene, J., Hockanson, David

Année:

2019

Fichier:

PDF, 61.61 MB

2019

50

Power Integrity for Electrical and Computer Engineers || Numerical Methods for Power Integrity

Ted Dibene, J., Hockanson, David

Année:

2019

Fichier:

PDF, 7.54 MB

2019